美國處理器大廠超微半導體(美:AMD)總裁蘇姿丰在台北國際電腦展(COMPUTEX)上指出,AMD與台積電TSMC(台:2330)緊密合作開發出領先業界的3D Chiplet技術,今年底前開始生產運用
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【芯片大戰】AMD、台積電合作開發3D Chiplet技術 料年底前生產運用 – 香港經濟日報 – 即時新聞頻道 – 即市財經 – 股市
2021-06-01T06:51:00-04:00June 1st, 2021|
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