On April 21, 2010, a component of Loongson’s 3A CPU was installed on the motherboard of the KD-60 supercomputer at the China University of Technology in Hefei, Anhui province’s capital. Image courtesy of Imaginechina. Continue reading
Loongson files US$542 million IPO in Shanghai to fund chip growth
2021-06-29T05:19:43-04:00June 29th, 2021|
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