LOS ANGELES — The U.S. is set to more than triple its semiconductor manufacturing capacity and control almost 30% of advanced chipmaking by 2032, thanks in no small part to the CHIPS Act.
The country could be producing 28% of chips below the 10-nanometer level by then, while China is expected to make only 2% of the most advanced chips, according to a report released Wednesday by the Semiconductor Industry Association (SIA) and Boston Consulting Group (BCG).
